Sponging / tinning with induction: Why not!
Due to the more difficult handling of lead-free solders with the flame, many have almost written off the process – wrongly.
With the lead-containing solders from the times before the ROHS directive, it was no great feat to bring the tin paste and above all the solder to the right temperature and above all to the desired position on the sheet using the flame.
With the new, lead-free materials, the melting points are significantly higher and, above all, the flow properties are impaired. With the flame, it is a real challenge to reach the right temperature.
The controlled heat of induction makes this much easier again. With a little practice and the spacer, the tin paste for the substrate treatment is first heated ‘from behind’ – by the sheet being heated by the induction. Thanks to the spacer, the inductor hovers about 5 mm above the surface and you can work at full power with the best visibility.
Heating the solder and keeping the tray warm at the same time is also not so difficult with the inductor. The nice thing about it: no stray heat like from the flame!
The wood will thank you for this by not charring and lasting longer due to the lack of flame. Alternatively, you can also work directly by reducing the power and using the Teflon cap.